中文
ENProducts
Trim/Form/Singulation Tooling
DIP、SOT、SOP、QFP、LQFP、DFN、TSOP、PBGA
Main purposeIt is mainly used for punching and forming after IC packaging
Functional featuresAutomatically complete the cutting, forming and separation of products
86-519-82906988
Mon. to Sun. 9:00-21:00Email：Sales.gx@jsgxzn.com
Add.：No. 365, Minghu Road, Jintan District, Changzhou City, Jiangsu Province
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