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Air Motorized Spindle
It is mainly used for post process packaging of integrated circuits, semiconductor devices and led substrates
The main applicable product packaging forms are: QFN, BGA, CSP, led substrate, etc industry status
The overall technical indicators of Guoxin air motorized spindle are benchmarked with the leading products of the industry, filling the domestic gap and breaking the international monopoly
| Basic Information | project | unit | GX-SM1800B | |
| For product substrates | - | Resin & Wafer | ||
| Rotating speed | RPM | 6000~60000 | ||
| power | KW | 1.8 | ||
| torque | NM | 0.29 | ||
| static beating | μm | 1 | ||
| air input | pressure | kgf/cm² | 5.5~6.5 | |
| temperature | °C | 20 | ||
| filter | μm | 0.5~0.1 | ||
| consumption | L/MIN | 60~70 | ||
| Coolant | cooling medium | °C | water | |
| pressure | kgf/cm² | 3 | ||
| flow | L/MIN | 1.5 | ||
| temperature | °C | 17~19 | ||
| motor | Mutually | - | 3 | |
| pole | - | 4 | ||
| type | - | BLDC | ||
| frequency | HZ | 2000 | ||
| Over temperature protection | - | none | ||
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